The Hacker 520 pick and placer with its low investment cost can be used in both R&D and large scale manufacturing applications.

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The Bondjet 710 is a deep access 89° wedge-to-wedge fine wire bonder, using a Wear-free Piezo technique capable of handling all types of wire including aluminium, gold, copper and ribbon across its large working area of 7.4"x7".

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The Hesse & Knips 320 can handle all types of material from grease to alcohol, making it extremely adaptable and able to meet most available dispense requirements in a single solution.

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The Hacker 520 dispenser has a compact footprint, yet with its work area is able to handle up to 10 Different materials at a time via the interchangeable cartridge handling system.

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Materials handling

Our catalogue has a range of automated handling systems, all fully SMEMA compatible, enabling the in-line automated processing that is required for large scale manufacturing.

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Benchmark is one of the leading innovators and world leaders in the supply and back-up of hermetic sealing solutions.

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