| Automatic
Precision die placement
The Hacker 520 pick and placer with its low investment cost can be used in both R&D and large scale manufacturing applications. Incorporating a compact footprint with multi-functional capability and modular structure, the Hacker 520 is able to handle numerous configurations of wafers, waffle-Paks and tape-feeders simultaneously on the input, with a 35 micron placement accuracy at 3500pph (parts per hour) for SMD, COB or Flip Chip assembly. Greater accuracy can be achieved with a lesser throughput. It is easily programmable via the touch screen display or optional external monitor and track-ball. The VICOŽ feedback control loop system, with it highly complex algorithms, keeps yield figures up and productivity moving where it is most important.
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Hacker 520 Placer Fast
set-up & change-over |