Microelectronics Assembly  

 


Automatic Precision die placement

http://www.Haecker-Automation.com

The Hacker 520 pick and placer with its low investment cost can be used in both R&D and large scale manufacturing applications.

Incorporating a compact footprint with multi-functional capability and modular structure, the Hacker 520 is able to handle numerous configurations of wafers, waffle-Paks and tape-feeders simultaneously on the input, with a 35 micron placement accuracy at 3500pph (parts per hour) for SMD, COB or Flip Chip assembly. Greater accuracy can be achieved with a lesser throughput.

It is easily programmable via the touch screen display or optional external monitor and track-ball.

The VICOŽ feedback control loop system, with it highly complex algorithms, keeps yield figures up and productivity moving where it is most important.

  • Contact us to discuss your requirements and how we can help you.

Hacker 520 Placer

Fast set-up & change-over
results in less down-time.

 

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