The Bondjet 710 is a deep access 89° wedge-to-wedge fine wire bonder, using a Wear-free Piezo technique capable of handling all types of wire including aluminium, gold, copper and ribbon across its large working area of 7.4"x7".
The machine's rigidity in construction and design ensures the Bondjet fine pitch capability and constant bond length. The bond quality monitoring system and software improves yield, and with a short loop capability of 150microns combines to make an easily programmable machine capable of meeting the demands of manufacturing.
All this, together with easy maintenance, full SMEMA compatibility, CE compliance and competitive pricing, makes a very capable solution either as a stand alone unit for R&D or combined into an auto assembly line.
The Bondjet 810, wedge-to-wedge bonder is just as adaptable as the 710 but with a much greater working area of 12.3"x7".
Real time data collection for up to 50 machines is also available as an option.
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Bondjet 710
The bond head is easily changed to an optional 60° bond head and matching frequency generator to allow other applications - all with no disruption to the manufacturing process.